Electronic Packaging Science and Technology
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![Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies Keser, Beth, Ph.D. (EDT); Kroehnert, Steffen (EDT) [New] [Hardcover]](https://pictures.abebooks.com/inventory/30974132690.jpg)
![Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition Tummala, Rao [Used - Very good] [Hardcover]](https://pictures.abebooks.com/isbn/9781259861550.jpg)



![The Science and Engineering of Materials (with CD-ROM) Donald R. Askeland; Pradeep P. Phulà [Used - Very good] [Hardcover]](https://pictures.abebooks.com/isbn/9780534953737.jpg)



















![Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies Keser, Beth, Ph.D. (EDT); Kroehnert, Steffen (EDT) [New] [Hardcover]](https://pictures.abebooks.com/inventory/30974132690.jpg)
![Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition Tummala, Rao [Used - Very good] [Hardcover]](https://pictures.abebooks.com/isbn/9781259861550.jpg)



![The Science and Engineering of Materials (with CD-ROM) Donald R. Askeland; Pradeep P. Phulà [Used - Very good] [Hardcover]](https://pictures.abebooks.com/isbn/9780534953737.jpg)



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