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1 store Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Springer

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

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Product Description

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts

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